SMT technology is widely applied in many electronic fields and the surface mount technology can be included with SMT finger, SMT standoff or shielding cover. Comply with the progressing of electronic science, not only high frequency let EMI problem get more serious but slim appearance and slight weight will make it worse. For the EMI and grounding solution, in traditional design, gasket foam is more popular before, but cannot satisfy volume and mass production and precision assemble because this is need to be assembled by hand.

We has developed SMT finger for many years, and its SMT packing feature will enable production speeding up and more precision due to its SMT automation. Now SMT finger is extensively applied in electronic product field, such as notebook, cellular phone, DSC, GPS…etc.